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THERM PAD 30M X 304.8MM YLW
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Quantity:
VI-J04-CY-F1
Vicor Corporation
UJA1076ATW/3V3/1J
NXP USA Inc.
845-076-540-207
EDAC Inc.
3QHTF57-121.000-OE
Mercury United Electronics, Inc.
PIC32MZ2025DAS169-I/6J
Microchip Technology
