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THERM PAD 228.6MMX228.6MM GRAY
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Quantity:
PIC16F722A-I/MV
Microchip Technology
74AHCT125D-Q100118
NXP USA Inc.
3QHTF53-118.800-OE
Mercury United Electronics, Inc.
SXT32418DD17-19.200M
Suntsu Electronics, Inc.
BKT-157-01-L-V-S-A
Samtec Inc.
