CUI Devices HSE-B18508-0396H

HEAT SINK, EXTRUSION, TO-218, 50

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1300630111

Molex

3QHTF32-50.071333-OE

Mercury United Electronics, Inc.

P6SMB400

Littelfuse Inc.

V375C3V3C75BS3

Vicor Corporation

PIC24FJ64GA110-E/PT

Microchip Technology