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HEAT SINK EXPERIMENT KIT
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Quantity:
MB95F434HPMC-G-SNE2
Infineon Technologies
MCJCQ31LBB7473MTPA01
Taiyo Yuden
228CDVAAFFMBB
CTS Electrocomponents
D55342E07B61B9STS
Vishay Dale Thin Film
RL0816S-2R4-F
Susumu
