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DICE (WAFER SAWN) - FRAME
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Menge:
BGU7063,518
NXP USA Inc.
CPS22-NC00A10-SNCCWTWF-AI0WCVAR-W1040-S
SCHURTER Inc.
C48-06R22Y55P7-406
Cinch Connectivity Solutions
VLS3015CX-4R7M-H
TDK Corporation
IRF630
STMicroelectronics