40-516-10

Aries Electronics

Produkt-Nr.:

40-516-10

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Beschreibung:

CONN IC DIP SOCKET ZIF 40POS TIN

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Contact Finish - Mating	Tin
Operating Temperature	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Current Rating (Amps)	1 A
Termination	Solder
Mounting Type	Through Hole
Material Flammability Rating	UL94 V-0
Product Status	Obsolete
Number of Positions or Pins (Grid)	40 (2 x 20)
Pitch - Post	0.100" (2.54mm)
Contact Finish Thickness - Post	10.0µin (0.25µm)
Series	516
Type	DIP, ZIF (ZIP)
Contact Finish - Post	Tin
Mfr	Aries Electronics
Termination Post Length	0.150" (3.81mm)
Features	Closed Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Contact Resistance	-
Package	Bulk