HSE-B18318-0396H

CUI Devices

Produkt-Nr.:

HSE-B18318-0396H

Hersteller:

Paket:

Charge:

Datenblatt:

Beschreibung:

HEAT SINK, EXTRUSION,TO-218, 31.

Menge:

Lieferung:

Zahlung:

Auf Lager : Bitte Anfrage

Bitte senden Sie RFQ, wir werden sofort antworten.

Name des Kontakts

E-Mail

Firmenname

Land

Menge

Shape	Rectangular, Angled Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.984" (25.00mm)
Series	HSE
Thermal Resistance @ Forced Air Flow	2.57°C/W @ 200 LFM
Type	Board Level, Vertical
Length	1.250" (31.75mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	8.24°C/W
Material Finish	Black Anodized
Package	Box
Attachment Method	Bolt On and PC Pin
Width	1.654" (42.00mm)
Power Dissipation @ Temperature Rise	9.1W @ 75°C
Diameter	-
Package Cooled	TO-218
Base Product Number	HSE-B18318