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HSE-B381-04H

CUI Devices

Produkt-Nr.:

HSE-B381-04H

Hersteller:

CUI Devices

Paket:

-

Charge:

-

Datenblatt:

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Beschreibung:

HEAT SINK, EXTRUSION, TO-220/TO-

Menge:

Lieferung:

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Zahlung:

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Auf Lager : Bitte Anfrage

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Produkt informationen

Parameter-Info

Benutzer handbuch

Shape Rectangular, Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.630" (16.00mm)
Series HSE
Thermal Resistance @ Forced Air Flow 4.44°C/W @ 200 LFM
Type Board Level, Vertical
Length 1.500" (38.10mm)
Mfr CUI Devices
Thermal Resistance @ Natural 12.71°C/W
Material Finish Black Anodized
Package Box
Attachment Method Bolt On and PC Pin
Width 0.650" (16.50mm)
Power Dissipation @ Temperature Rise 5.9W @ 75°C
Diameter -
Package Cooled TO-218, TO-220
Base Product Number HSE-B381