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HSE02-173213P

CUI Devices

Produkt-Nr.:

HSE02-173213P

Hersteller:

CUI Devices

Paket:

-

Charge:

-

Datenblatt:

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Beschreibung:

HEAT SINK, EXTRUSION, 17 X 31.9

Menge:

Lieferung:

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Zahlung:

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Auf Lager : Bitte Anfrage

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Produkt informationen

Parameter-Info

Benutzer handbuch

Shape Square, Angled Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.492" (12.50mm)
Series HSE
Thermal Resistance @ Forced Air Flow 6.70°C/W @ 200 LFM
Type Top Mount
Length 0.669" (17.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 21.44°C/W
Material Finish Blue Anodized
Package Box
Attachment Method Thermal Tape, Adhesive (Included)
Width 0.669" (17.00mm)
Power Dissipation @ Temperature Rise 3.5W @ 75°C
Diameter -
Package Cooled -