WB3F200VD1

JAE Electronics

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WB3F200VD1

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Beschreibung:

CONN RCPT 200POS SMD GOLD

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Number of Rows	2
Number of Positions	200
Contact Finish Thickness	30.0µin (0.76µm)
Contact Finish	Gold
Height Above Board	0.098" (2.50mm)
Mounting Type	Surface Mount
Product Status	Obsolete
Series	WB3
Mfr	JAE Electronics
Pitch	0.020" (0.50mm)
Connector Type	Receptacle, Center Strip Contacts
Features	Board Guide, Solder Retention
Mated Stacking Heights	4mm, 5mm
Package	Tray
Base Product Number	WB3F200