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BDN15-3CB/A01

CTS Thermal Management Products

Produkt-Nr.:

BDN15-3CB/A01

Paket:

-

Charge:

-

Datenblatt:

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Beschreibung:

HEATSINK CPU W/ADHESIVE 1.51"SQ

Menge:

Lieferung:

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Zahlung:

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Produkt informationen

Parameter-Info

Benutzer handbuch

Shape Square, Pin Fins
Material Aluminum
Product Status Active
Fin Height 0.355" (9.02mm)
Series BDN
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 400 LFM
Type Top Mount
Length 1.510" (38.35mm)
Mfr CTS Thermal Management Products
Thermal Resistance @ Natural 15.10°C/W
Material Finish Black Anodized
Shelf Life 24 Months
Package Tray
Attachment Method Thermal Tape, Adhesive (Included)
Width 1.510" (38.35mm)
Power Dissipation @ Temperature Rise -
Diameter -
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Base Product Number BDN15