CTS Thermal Management Products
Produkt-Nr.:
BDN15-3CB/A01
Hersteller:
Paket:
-
Charge:
-
Beschreibung:
HEATSINK CPU W/ADHESIVE 1.51"SQ
Menge:
Lieferung:

Zahlung:
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| Shape | Square, Pin Fins |
| Material | Aluminum |
| Product Status | Active |
| Fin Height | 0.355" (9.02mm) |
| Series | BDN |
| Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 400 LFM |
| Type | Top Mount |
| Length | 1.510" (38.35mm) |
| Mfr | CTS Thermal Management Products |
| Thermal Resistance @ Natural | 15.10°C/W |
| Material Finish | Black Anodized |
| Shelf Life | 24 Months |
| Package | Tray |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Width | 1.510" (38.35mm) |
| Power Dissipation @ Temperature Rise | - |
| Diameter | - |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Base Product Number | BDN15 |