ESD-113-T-03

Samtec Inc.

Produkt-Nr.:

ESD-113-T-03

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Beschreibung:

CONN SOCKET 26POS 0.1 GOLD PCB

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Auf Lager : 99

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Insulation Height	0.300" (7.62mm)
Ingress Protection	-
Voltage Rating	-
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Current Rating (Amps)	-
Contact Type	Female Socket
Material Flammability Rating	UL94 V-0
Product Status	Active
Mfr	Samtec Inc.
Contact Material	Beryllium Copper
Connector Type	Elevated Socket
Style	Board to Board
Features	-
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	26
Termination	Solder
Mounting Type	Through Hole
Fastening Type	Push-Pull
Insulation Material	Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Post	-
Contact Shape	Circular
Series	ESD
Row Spacing - Mating	0.100" (2.54mm)
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	0.153" (3.89mm)
Number of Positions Loaded	All
Mated Stacking Heights	-
Package	Bulk
Base Product Number	ESD-113