FI-XB30SSLA-HF15

JAE Electronics

Produkt-Nr.:

FI-XB30SSLA-HF15

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Beschreibung:

CONN RCPT 30P 0.039 GOLD SMD R/A

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Auf Lager : 1441

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Insulation Height	-
Ingress Protection	-
Voltage Rating	200V
Contact Finish Thickness - Mating	3.90µin (0.099µm)
Current Rating (Amps)	1A per Contact
Contact Type	Non-Gendered
Material Flammability Rating	UL94 V-0
Product Status	Active
Mfr	JAE Electronics
Contact Material	Copper Alloy
Connector Type	Receptacle
Style	Board to Cable/Wire
Features	Grounding Pins, Shielded, Solder Retention
Pitch - Mating	0.039" (1.00mm)
Contact Finish - Mating	Gold
Operating Temperature	-40°C ~ 80°C
Number of Rows	1
Applications	General Purpose
Number of Positions	30
Termination	Solder
Mounting Type	Board Cutout, Bottom Mount, Surface Mount, Right Angle
Fastening Type	Friction Lock
Insulation Material	Plastic
Contact Finish Thickness - Post	-
Contact Shape	-
Series	FI-X
Row Spacing - Mating	-
Contact Finish - Post	Tin
Insulation Color	Beige
Contact Length - Post	-
Number of Positions Loaded	All
Mated Stacking Heights	-
Package	Tape & Reel (TR)
Base Product Number	FI-XB30