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HSE-B1711-032

CUI Devices

Produkt-Nr.:

HSE-B1711-032

Hersteller:

CUI Devices

Paket:

-

Charge:

-

Datenblatt:

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Beschreibung:

HEAT SINK, EXTRUSION, TO-220, 25

Menge:

Lieferung:

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Zahlung:

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Auf Lager : Bitte Anfrage

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Produkt informationen

Parameter-Info

Benutzer handbuch

Shape Rectangular, Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.354" (9.00mm)
Series HSE
Thermal Resistance @ Forced Air Flow 6.84°C/W @ 200 LFM
Type Board Level
Length 0.984" (25.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 20.27°C/W
Material Finish Black Anodized
Package Box
Attachment Method Bolt On
Width 0.625" (16.00mm)
Power Dissipation @ Temperature Rise 3.7W @ 75°C
Diameter -
Package Cooled TO-220
Base Product Number HSE-B1711