ICF-632-S-O

Samtec Inc.

Produkt-Nr.:

ICF-632-S-O

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Beschreibung:

CONN IC DIP SOCKET 32POS TIN

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Contact Finish - Mating	Tin
Operating Temperature	-55°C ~ 125°C
Contact Material - Post	Beryllium Copper
Housing Material	Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Mating	-
Termination	Solder
Mounting Type	Surface Mount
Material Flammability Rating	-
Product Status	Active
Number of Positions or Pins (Grid)	32 (2 x 16)
Pitch - Post	0.100" (2.54mm)
Contact Finish Thickness - Post	-
Series	iCF
Type	DIP, 0.6" (15.24mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Samtec Inc.
Termination Post Length	-
Features	Open Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Contact Resistance	10mOhm
Package	Tube
Base Product Number	ICF-632