08-2513-10

Aries Electronics

Producto No:

08-2513-10

Fabricante:

Paquete:

Lote:

Ficha de datos:

Descripción:

CONN IC DIP SOCKET 8POS GOLD

Cantidad:

Entrega:

Pago:

En stock : 335

Mínimo: 1 Múltiplos: 1

Qty

Precio unitario

Precio Ext

¿No es el precio que quieres? Envíe RFQ ahora y nos pondremos en contacto con usted lo antes posible.

Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 105°C
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Current Rating (Amps)	3 A
Termination	Solder
Mounting Type	Through Hole
Material Flammability Rating	UL94 V-0
Product Status	Active
Number of Positions or Pins (Grid)	8 (2 x 4)
Pitch - Post	0.100" (2.54mm)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Series	Lo-PRO®file, 513
Type	DIP, 0.2" (5.08mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Aries Electronics
Termination Post Length	0.125" (3.18mm)
Features	Closed Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Contact Resistance	-
Package	Bulk
Base Product Number	08-2513