24-526-10

Aries Electronics

Producto No:

24-526-10

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Descripción:

CONN IC DIP SOCKET ZIF 24POS TIN

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En stock : 36

Mínimo: 1 Múltiplos: 1

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Contact Finish - Mating	Tin
Operating Temperature	-55°C ~ 105°C
Contact Material - Post	Beryllium Copper
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Current Rating (Amps)	3 A
Termination	Solder
Mounting Type	Through Hole
Material Flammability Rating	UL94 V-0
Product Status	Active
Number of Positions or Pins (Grid)	24 (2 x 12)
Pitch - Post	0.100" (2.54mm)
Contact Finish Thickness - Post	10.0µin (0.25µm)
Series	Lo-PRO®file, 526
Type	DIP, ZIF (ZIP)
Contact Finish - Post	Tin
Mfr	Aries Electronics
Termination Post Length	0.105" (2.67mm)
Features	Closed Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Contact Resistance	-
Package	Bulk
Base Product Number	24-526