24-6554-11

Aries Electronics

Producto No:

24-6554-11

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Descripción:

CONN IC DIP SOCKET ZIF 24POS GLD

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En stock : 44

Mínimo: 1 Múltiplos: 1

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Contact Finish - Mating	Gold
Operating Temperature	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish Thickness - Mating	-
Current Rating (Amps)	1 A
Termination	Solder
Mounting Type	Through Hole
Material Flammability Rating	UL94 V-0
Product Status	Active
Number of Positions or Pins (Grid)	24 (2 x 12)
Pitch - Post	0.100" (2.54mm)
Contact Finish Thickness - Post	-
Series	55
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Contact Finish - Post	Gold
Mfr	Aries Electronics
Termination Post Length	0.110" (2.78mm)
Features	Closed Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Contact Resistance	-
Package	Bulk
Base Product Number	24-655