28-6554-10

Aries Electronics

Producto No:

28-6554-10

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CONN IC DIP SOCKET ZIF 28POS TIN

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En stock : 79

Mínimo: 1 Múltiplos: 1

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Contact Finish - Mating	Tin
Operating Temperature	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Current Rating (Amps)	1 A
Termination	Solder
Mounting Type	Through Hole
Material Flammability Rating	UL94 V-0
Product Status	Active
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Post	0.100" (2.54mm)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Series	55
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Aries Electronics
Termination Post Length	0.110" (2.78mm)
Features	Closed Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Contact Resistance	-
Package	Bulk
Base Product Number	28-6554