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HSE01-193175P

CUI Devices

Producto No:

HSE01-193175P

Fabricante:

CUI Devices

Paquete:

-

Lote:

-

Ficha de datos:

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Descripción:

HEAT SINK, EXTRUSION, 19 X 31.5

Cantidad:

Entrega:

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Pago:

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En stock : 985

Mínimo: 1 Múltiplos: 1

Qty

Precio unitario

Precio Ext

  • 1

    $1.805

    $1.805

  • 10

    $1.74325

    $17.4325

  • 25

    $1.69252

    $42.313

  • 50

    $1.59182

    $79.591

  • 100

    $1.430605

    $143.0605

  • 250

    $1.410484

    $352.621

  • 500

    $1.319797

    $659.8985

  • 1000

    $1.299638

    $1299.638

¿No es el precio que quieres? Envíe RFQ ahora y nos pondremos en contacto con usted lo antes posible.

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Información del producto

Parámetro Info

Guía del usuario

Shape Square, Angled Fins
Material Aluminum Alloy
Product Status Active
Fin Height 0.295" (7.50mm)
Series HSE
Thermal Resistance @ Forced Air Flow 9.20°C/W @ 200 LFM
Type Top Mount
Length 0.748" (19.00mm)
Mfr CUI Devices
Thermal Resistance @ Natural 25.44°C/W
Material Finish Blue Anodized
Package Box
Attachment Method Thermal Tape, Adhesive (Included)
Width 0.748" (19.00mm)
Power Dissipation @ Temperature Rise 2.95W @ 75°C
Diameter -
Package Cooled -