CUI Devices
Producto No:
HSS24-B20-NP
Fabricante:
Paquete:
-
Lote:
-
Descripción:
HEAT SINK, STAMPING, TO-218/TO-2
Cantidad:
Entrega:

Pago:
Mínimo: 1 Múltiplos: 1
Qty
Precio unitario
Precio Ext
1
$0.931
$0.931
10
$0.88255
$8.8255
25
$0.83866
$20.9665
50
$0.81662
$40.831
100
$0.805505
$80.5505
250
$0.750348
$187.587
500
$0.706192
$353.096
1000
$0.639986
$639.986
5000
$0.617918
$3089.59
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| Shape | Rectangular, Fins |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.984" (25.00mm) |
| Series | HSS |
| Thermal Resistance @ Forced Air Flow | 4.30°C/W @ 200 LFM |
| Type | Top Mount |
| Length | 1.654" (42.00mm) |
| Mfr | CUI Devices |
| Thermal Resistance @ Natural | 9.56°C/W |
| Material Finish | Black Anodized |
| Package | Box |
| Attachment Method | Bolt On |
| Width | 1.496" (38.00mm) |
| Power Dissipation @ Temperature Rise | 7.85W @ 75°C |
| Diameter | - |
| Package Cooled | TO-218, TO-220 |