DIP628-014BLF

Amphenol ICC (FCI)

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DIP628-014BLF

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Descripción:

CONN IC DIP SOCKET 28POS TIN

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En stock : Por favor investigación

Por favor envíe RFQ, responderemos inmediatamente.

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Contact Finish - Mating	Tin
Operating Temperature	-
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Finish Thickness - Mating	100.0µin (2.54µm)
Termination	Solder
Mounting Type	Through Hole
Material Flammability Rating	UL94 V-0
Product Status	Obsolete
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Post	0.100" (2.54mm)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Series	-
Type	DIP, 0.6" (15.24mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Amphenol ICC (FCI)
Termination Post Length	0.125" (3.18mm)
Features	Open Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Contact Resistance	-
Package	Bag
Base Product Number	DIP628