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XR2A-1801-N

Omron Electronics Inc-EMC Div

Prodotto No:

XR2A-1801-N

Pacchetto:

-

Batch:

-

Scheda tecnica:

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Descrizione:

CONN IC DIP SOCKET 18POS GOLD

Quantità:

Consegna:

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Pagamento:

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In magazzino : 50

Minimo: 1 Multipli: 1

Qty

Prezzo unitario

Prezzo Ext

  • 1

    $2.945

    $2.945

  • 10

    $2.6695

    $26.695

  • 25

    $2.5289

    $63.2225

  • 50

    $2.47

    $123.5

  • 100

    $2.35239

    $235.239

  • 250

    $2.058346

    $514.5865

  • 500

    $1.999522

    $999.761

  • 1000

    $1.705478

    $1705.478

  • 2500

    $1.705383

    $4263.4575

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Informazioni sul prodotto

Info parametro

Guida per l'utente

Contact Finish - Mating Gold
Operating Temperature -55°C ~ 125°C
Contact Material - Post Beryllium Copper
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Current Rating (Amps) 1 A
Termination Solder
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Product Status Active
Number of Positions or Pins (Grid) 18 (2 x 9)
Pitch - Post 0.100" (2.54mm)
Contact Finish Thickness - Post 30.0µin (0.76µm)
Series XR2
Type DIP, 0.3" (7.62mm) Row Spacing
Contact Finish - Post Gold
Mfr Omron Electronics Inc-EMC Div
Termination Post Length 0.126" (3.20mm)
Features Open Frame
Contact Material - Mating Beryllium Copper
Pitch - Mating 0.100" (2.54mm)
Contact Resistance 20mOhm
Package Bulk
Base Product Number XR2A