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110070016

Seeed Technology Co., Ltd

Prodotto No:

110070016

Pacchetto:

-

Batch:

-

Scheda tecnica:

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Descrizione:

RPI HEAT SINK KIT COPPER/ALUM

Quantità:

Consegna:

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Pagamento:

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In magazzino : Si prega di richiesta

Si prega di inviare RdO, risponderemo immediatamente.

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Informazioni sul prodotto

Info parametro

Guida per l'utente

Shape Square
Material Aluminum, Copper
Product Status Obsolete
Fin Height -
Series -
Thermal Resistance @ Forced Air Flow -
Type Heat Spreader Kit, Top Mount
Length -
Mfr Seeed Technology Co., Ltd
Thermal Resistance @ Natural -
Material Finish -
Shelf Life -
Package Bulk
Attachment Method -
Width -
Power Dissipation @ Temperature Rise -
Diameter -
Package Cooled Raspberry Pi