ESW-113-33-G-D

Samtec Inc.

Prodotto No:

ESW-113-33-G-D

Produttore:

Pacchetto:

Batch:

Scheda tecnica:

Descrizione:

CONN SOCKET 26POS 0.1 GOLD PCB

Quantità:

Consegna:

Pagamento:

In magazzino : 37

Minimo: 1 Multipli: 1

Qty

Prezzo unitario

Prezzo Ext

Non è il prezzo che vuoi? Invia RdO ora e ti contatteremo al più presto.

Insulation Height	0.635" (16.13mm)
Ingress Protection	-
Voltage Rating	550VAC
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Current Rating (Amps)	5.2A per Contact
Contact Type	Forked
Material Flammability Rating	UL94 V-0
Product Status	Active
Mfr	Samtec Inc.
Contact Material	Phosphor Bronze
Connector Type	Elevated Socket
Style	Board to Board
Features	-
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Operating Temperature	-55°C ~ 125°C
Number of Rows	2
Applications	-
Number of Positions	26
Termination	Solder
Mounting Type	Through Hole
Fastening Type	Push-Pull
Insulation Material	Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Post	3.00µin (0.076µm)
Contact Shape	Square
Series	ESW
Row Spacing - Mating	0.100" (2.54mm)
Contact Finish - Post	Gold
Insulation Color	Black
Contact Length - Post	0.090" (2.29mm)
Number of Positions Loaded	All
Mated Stacking Heights	-
Package	Tube
Base Product Number	ESW-113