FI-TD50SB-E

JAE Electronics

Prodotto No:

FI-TD50SB-E

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CONN RCPT 50POS 0.05 GOLD SMD

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Insulation Height	0.110" (2.79mm)
Ingress Protection	-
Voltage Rating	-
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Current Rating (Amps)	0.5A per Contact
Contact Type	Center Strip Contact
Material Flammability Rating	UL94 V-0
Product Status	Obsolete
Mfr	JAE Electronics
Contact Material	Copper Alloy
Connector Type	Receptacle
Style	Board to Cable/Wire
Features	Board Guide, Pick and Place, Solder Retention
Pitch - Mating	0.020" (0.50mm)
Contact Finish - Mating	Gold
Operating Temperature	-40°C ~ 85°C
Number of Rows	1
Applications	General Purpose
Number of Positions	50
Termination	Solder
Mounting Type	Surface Mount
Fastening Type	Latch Holder
Insulation Material	Thermoplastic
Contact Finish Thickness - Post	-
Contact Shape	-
Series	FI-D
Row Spacing - Mating	-
Contact Finish - Post	Tin
Insulation Color	Black
Contact Length - Post	-
Number of Positions Loaded	All
Mated Stacking Heights	4.5mm
Package	Bulk
Base Product Number	FI-TD50